Investigation of Annealing Temperature on Copper Oxide Thin Films Using Sol-Gel Spin Coating Technique

• Main Authors: Hashim, H. (Author), Saad, P.S.M (Author), Samat, S.F.A (Author), Shariffudin, S.S (Author)
• Format: Article
• Language: English
• Published: Institute of Physics Publishing 2018
• Subjects: Annealing; Annealing process; Annealing temperatures; Atomic force microscopy; Coatings; Copper oxide thin films; Copper oxides; Effect of annealing; Electronic equipment; Energy gap; Optical data processing; Optical measurement; Oxide films; Quartz substrate; Sol-gel process; Sol-gel spin coating; Sol-gels; Surface profilers; Thermoelectric equipment; Thin films
• Online Access: View Fulltext in Publisher; View in Scopus
• ISBN: 17578981 (ISSN)
• DOI: 10.1088/1757-899X/340/1/012008

Copper (II) Oxide or cupric oxide (CuO) is one of the well-known materials studied for thin films applications. This paper was studied on the effect of annealing temperature to CuO thin films using sol-gel method and spin coating technique. The solution was prepared by sol-gel method and the thin films were synthesized at various temperatures from 500°C to 700°C that deposited onto the quartz substrates. After the annealing process, the thin films were uniform and brownish black in colour. The measurements were performed by atomic force microscopy (AFM), surface profiler (SP), two-point probe and Ultraviolet-visible (UV-Vis-NIR) spectrometer. From the optical measurement, the band gap was estimated to be 1.44eV for sample annealed at 550°C. © Published under licence by IOP Publishing Ltd.