The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder
Due to environmental concerns, lead free solders were introduced in replacing the lead based solders in microelectronic devices technology. Among many lead-free solders, the Sn-3.5Ag-1.0Cu solder is the potential replacement for the Sn-Pb solder. This research was carried out to improve the properti...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
American Institute of Physics Inc.
2018
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| Subjects: | |
| Online Access: | View Fulltext in Publisher View in Scopus |
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