The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder

The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder

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Due to environmental concerns, lead free solders were introduced in replacing the lead based solders in microelectronic devices technology. Among many lead-free solders, the Sn-3.5Ag-1.0Cu solder is the potential replacement for the Sn-Pb solder. This research was carried out to improve the properti...

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Bibliographic Details
Main Authors:	Andas J. (Author), Ghani, N.A.A (Author), Mayappan R. (Author), Mayappan, R. (Author), Yahya, I. (Author)
Format:	Article
Language:	English
Published:	American Institute of Physics Inc. 2018
Subjects:	growth kinetics Intermetallic compounds lead-free solder SAC-Ni solder joint
Online Access:	View Fulltext in Publisher View in Scopus

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