The effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder
Solder has been widely used in electronic industry as interconnection for electronic packaging. European Union and Japan have restricted the use of Sn-Pb solder as it contains lead which can harmful to human health and environment. Due to this, many researches have been done in order to find a suita...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
American Institute of Physics Inc.
2017
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| Subjects: | |
| Online Access: | View Fulltext in Publisher View in Scopus |
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