Modeling of nonlinear active and passive devices in three-dimensional TLM networks
The increase in clock rate and integration density in modem IC technology leads to complex interactions among different parts of the circuit. These interactions are poorly represented with traditional lumped circuit design methodologies. Traditional CAD tools, such as SPICE, provide very accurate...
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| Language: | English en |
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2017
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| Online Access: | http://hdl.handle.net/1828/8248 |