Caractérisation du transport fluidique et thermique dans les mousses métalliques capillaires en cuivre
Thermal management of electronics has become a major challenge in manufacturing and production of high performance electronic chips. Constant rise of computation power requires higher amount of energy and subsequently this energy (in the form of heat) should be transferred out of the computer. Among...
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| Language: | English |
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Université de Sherbrooke
2015
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| Online Access: | http://hdl.handle.net/11143/6141 |