Characterization of Post-Plasma Etch Residues and Plasma Induced Damage Evaluation on Patterned Porous Low-K Dielectrics Using MIR-IR Spectroscopy
As the miniaturization of functional devices in integrated circuit (IC) continues to scale down to sub-nanometer size, the process complexity increases and makes materials characterization difficult. One of our research effort demonstrates the development and application of novel Multiple Internal R...
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| Format: | Others |
| Language: | English |
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University of North Texas
2016
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc849694/ |