Fundamental Studies of Copper Corrosion in Interconnect Fabrication Process and Spectroscopic Investigation of Low-k Structures

In the first part of this dissertation, copper bimetallic corrosion and its inhibition in cleaning processes involved in interconnect fabrication is explored. In microelectronics fabrication, post chemical mechanical polishing (CMP) cleaning is required to remove organic contaminants and particles l...

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Bibliographic Details
Main Author: Goswami, Arindom
Other Authors: Chyan, Oliver Ming-Ren
Format: Others
Language:English
Published: University of North Texas 2015
Subjects:
Online Access:https://digital.library.unt.edu/ark:/67531/metadc822794/

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