Fundamental Studies of Copper Corrosion in Interconnect Fabrication Process and Spectroscopic Investigation of Low-k Structures
In the first part of this dissertation, copper bimetallic corrosion and its inhibition in cleaning processes involved in interconnect fabrication is explored. In microelectronics fabrication, post chemical mechanical polishing (CMP) cleaning is required to remove organic contaminants and particles l...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | English |
| Published: |
University of North Texas
2015
|
| Subjects: | |
| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc822794/ |