Comparison of 43Sn/43Pb/14Bi Solder and Standard 60Sn/40Pb Solder by Thermocyclic Fatigue Analysis
The thermocyclic fatigue behavior of the low-melting solder 43Sn/43Pb/14Bi has been investigated and compared to that of standard 60Sn/4OPb solder via metallographic analysis (using scanning electron microscopy) and evaluation of the degree of fatigue development (using a fatigue scale as a function...
Main Author: | Calderon, Jose Guadalupe |
---|---|
Other Authors: | Marshall, James L. |
Format: | Others |
Language: | English |
Published: |
University of North Texas
1991
|
Subjects: | |
Online Access: | https://digital.library.unt.edu/ark:/67531/metadc501128/ |
Similar Items
-
Observation and modeling of heterogeneous microstructural evolution in Sn-Pb solder
by: Woodmansee, Michael W.
Published: (2007) -
Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
by: Anas M. Atieh, et al.
Published: (2019-10-01) -
A Study of the Processing Properties of Hard-Particle Reinforced Composite Solders
by: Calderon, Jose Guadalupe
Published: (1994) -
Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
by: Mayappan, Ramani, et al.
Published: (2010) -
PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
by: A. A. CHULARIS, et al.
Published: (2018-07-01)