Effects of Plasma, Temperature and Chemical Reactions on Porous Low Dielectric Films for Semiconductor Devices
Low-dielectric (k) films are one of the performance drivers for continued scaling of integrated circuit devices. These films are needed in microelectronic device interconnects to lower power consumption and minimize cross talk between metal lines that "interconnect" transistors. Low-k mate...
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| Format: | Others |
| Language: | English |
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University of North Texas
2010
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| Online Access: | https://digital.library.unt.edu/ark:/67531/metadc33192/ |