Nouveaux concepts pour l'intégration 3D et le refroidissement des semi-conducteurs de puissance à structure verticale

Nouveaux concepts pour l'intégration 3D et le refroidissement des semi-conducteurs de puissance à structure verticale

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L'électronique de puissance est en pleine mutation matérielle, technologique et conceptuelle. Cette évolution bouscule l'approche traditionnelle de la conception et de la fabrication des convertisseurs statiques avec pour objectif de proposer des solutions plus performantes, plus fiables e...

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Bibliographic Details
Main Author:	Vladimirova, Kremena
Other Authors:	Grenoble
Language:	fr
Published:	2012
Subjects:	Concept DRIM Cooler Intégration 3D Refroidissement direct Puces multicomposants de puissance Terminaisons en tension verticales DRIM Cooler concept 3D integration Direct cooling Single die multiple power devices Ertical voltage terminations
Online Access:	http://www.theses.fr/2012GRENT049/document

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