Extended surface heat sinks for electronic components: a computer optimization.

• Main Author: Gensure, John Reynold
• Other Authors: Kraus, Allan D.
• Language: en_US
• Published: Monterey, California. Naval Postgraduate School 2012
• Online Access: http://hdl.handle.net/10945/23672

Approved for public release; distribution is unlimited === Heat sinks consisting of individual fins and arrays of fins are used extensively throughout the Navy and industry. The fins serve to increase the surface area thorough which heat is transferred to the surrounding environment by natural convection. Extended surfaces or fins are commonly found on electronic components ranging from power supplies to transformers. The dissipation and subsequent rejection of potentially destructive self produced heat is an important aspect of electronic equipment design. Fin design theory is examined starting with the optimization of individual fin dimensions. The insights obtained are utilized in an investigation of the optimal number and spacing of elements in an array of fins. The results are implemented in a computer program written in ADA and compiled for use on IBM compatible machines. The program takes as inputs thermal and physical data and outputs an optimized fin configuration. Menu driven, the program is easily employed without any amplifying documentation. The program serves to greatly simplify and accelerate the fin design process and should be an invaluable tool to electronic component designers, especially those with a limited background in heat transfer and fin optimization theory.