An experimental approach for studying the creep behavior of thin film/ substrate interfaces
Approved for public release; distribution is unlimited === Large shear stresses often develop at the interface between dissimilar materials in microelectronic devices, when they are subjected to thermo-mechanical excursions. These stresses can facilitate diffusionally accommodated interfacial slidin...
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Monterey, California. Naval Postgraduate School
2012
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| Online Access: | http://hdl.handle.net/10945/1368 |