Factors affecting creep in gold on silicon bi-layer MEMS cantilevered beams
This research identifies factors that contribute to creep in bi-layer gold on polysilicon MEMS beams. Beams used in this research were manufactured using the Multi-User MEMS Process (MUMPs). Their thicknesses were 2(micrometer) or 4(micrometers) (O.5(micrometers) gold on either 1.5(micrometers) or 3...
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2012
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| Online Access: | http://hdl.handle.net/10945/11038 |