Factors affecting creep in gold on silicon bi-layer MEMS cantilevered beams
This research identifies factors that contribute to creep in bi-layer gold on polysilicon MEMS beams. Beams used in this research were manufactured using the Multi-User MEMS Process (MUMPs). Their thicknesses were 2(micrometer) or 4(micrometers) (O.5(micrometers) gold on either 1.5(micrometers) or 3...
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2012
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| Online Access: | http://hdl.handle.net/10945/11038 |
| Summary: | This research identifies factors that contribute to creep in bi-layer gold on polysilicon MEMS beams. Beams used in this research were manufactured using the Multi-User MEMS Process (MUMPs). Their thicknesses were 2(micrometer) or 4(micrometers) (O.5(micrometers) gold on either 1.5(micrometers) or 3.5(micrometers) polysilicon), these beams were all 20(micrometers) wide and ranged in length from 80(micrometers) to 280(micrometers) in increments of 40(micrometers). Numerous thermal cycling tests and isothermal hold experiments were conducted at various temperatures. Initial thermal cycling took place at temperatures ranging from room temperature to 275 degrees C, and time durations ranging from 5 to 400 minutes. Isothermal hold experiments were conducted at temperatures ranging from 30 degrees C to 180 degrees C, all isothermal holds have duration of approximately 200 hours. Data was gathered using a Zygo white light interferometric microscope. |
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