Dynamic response of soldered electronic components under impact loading

Dynamic response of soldered electronic components under impact loading

The objective of this research was to analyze the effects of impact loading on electronic component failure. A standard fiberglass composite printed circuit board (PCB) card was used in two impact tests. The first test consisted of a PCB card with four adhered strain gauges, which were mounted ins...

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Bibliographic Details
Main Author:	Wood, Andrew Calvin
Other Authors:	Kwon, Young W.
Published:	Monterey, California. Naval Postgraduate School 2012
Online Access:	http://hdl.handle.net/10945/10714

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