Dummy TSV-Based Timing Optimization for 3D On-Chip Memory
Design and fabrication of three-dimensional (3D) ICs is one the newest and hottest trends in semiconductor manufacturing industry. In 3D ICs, multiple 2D silicon dies are stacked vertically, and through silicon vias (TSVs) are used to transfer power and signals between different dies. The electrica...
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North Dakota State University
2018
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| Online Access: | https://hdl.handle.net/10365/28007 |