Height inspection of wafer bumps without explicit 3D reconstruction.

• Other Authors: Dong, Mei.
• Format: Others
• Language: English; Chinese
• Published: 2007
• Subjects: Semiconductor wafers > Inspection; Surface roughness > Measurement; Flatness measurement
• Online Access: http://library.cuhk.edu.hk/record=b5893093; http://repository.lib.cuhk.edu.hk/en/item/cuhk-325847

by Dong, Mei. === Thesis (M.Phil.)--Chinese University of Hong Kong, 2007. === Includes bibliographical references (leaves 83-90). === Abstracts in English and Chinese. === INTRODUCTION --- p.1 === Chapter 1.1 --- Bump Height Inspection --- p.1 === Chapter 1.2 --- Our Height Inspection System --- p.2 === Chapter 1.3 --- Thesis Outline --- p.3 === BACKGROUND --- p.5 === Chapter 2.1 --- Wafer Bumps --- p.5 === Chapter 2.2 --- Common Defects of Wafer Bumps --- p.7 === Chapter 2.3 --- Traditional Methods for Bump Inspection --- p.11 === BIPLANAR DISPARITY METHOD --- p.22 === Chapter 3.1 --- Problem Nature --- p.22 === Chapter 3.2 --- System Overview --- p.25 === Chapter 3.3 --- Biplanar Disparity Matrix D --- p.30 === Chapter 3.4 --- Planar Homography --- p.36 === Chapter 3.4.1 --- Planar Homography --- p.36 === Chapter 3.4.2 --- Homography Estimation --- p.39 === Chapter 3.5 --- Harris Corner Detector --- p.45 === Chapter 3.6 --- Experiments --- p.47 === Chapter 3.6.1 --- Synthetic Experiments --- p.47 === Chapter 3.6.2 --- Real image experiment --- p.52 === Chapter 3.7 --- Conclusion and problems --- p.61 === PARAPLANAR DISPARITY METHOD --- p.62 === Chapter 4.1 --- The Parallel Constraint --- p.63 === Chapter 4.2 --- Homography estimation --- p.66 === Chapter 4.3. --- Experiment: --- p.69 === Chapter 4.3.1 --- Synthetic Experiment: --- p.69 === Chapter 4.3.2 --- Real Image Experiment: --- p.74 === CONCLUSION AND FUTURE WORK --- p.80 === Chapter 5.1 --- Summary of the contributions --- p.80 === Chapter 5.2 --- Future Work --- p.81 === Publication related to this work: --- p.83 === BIBLIOGRAPHY --- p.83