Non-contact batch micro-assembly by centrifugal force.

• Other Authors: Lai, Wai Chiu King.
• Format: Others
• Language: English; Chinese
• Published: 2002
• Subjects: Microelectromechanical systems; Optoelectronic devices; Switching circuits
• Online Access: http://library.cuhk.edu.hk/record=b5891286; http://repository.lib.cuhk.edu.hk/en/item/cuhk-323903

Lai, Wai Chiu King. === Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. === Includes bibliographical references (leaves 87-89). === Abstracts in English and Chinese. === LIST OF TABLES --- p.vi === LIST OF FIGURES --- p.vii === Chapter 1. --- Introduction --- p.1 === Chapter 1.1 --- Background --- p.1 === Chapter 1.2 --- Organization of the thesis --- p.3 === Chapter 2. --- Literature Survey --- p.5 === Chapter 2.1 --- Micro Hinges --- p.5 === Chapter 2.2 --- Assembly --- p.5 === Chapter 2.2.1 --- Manual Lift Up Process --- p.5 === Chapter 2.2.2 --- Assembly by On-substrate Actuators --- p.6 === Chapter 2.2.3 --- Assembly by Surface Tension Force --- p.8 === Chapter 2.2.4 --- Assembly by Thermal Shrinkage --- p.8 === Chapter 2.2.5 --- Assembly by Ultrasonic Triboelectricity --- p.9 === Chapter 2.3 --- Summary of Literature Survey --- p.9 === Chapter 3. --- Design & Analysis --- p.11 === Chapter 3.1 --- Micro-Assembly by Centrifugal Force --- p.11 === Chapter 3.2 --- Micro Mass Platform --- p.12 === Chapter 3.2.1 --- Micro Mirror --- p.12 === Chapter 3.2.2 --- Rotation Sensor --- p.15 === Chapter 3.3 --- Fabrication of Micro Structures --- p.16 === Chapter 3.4 --- Force Analysis --- p.18 === Chapter 3.4.1 --- Centrifugal Force --- p.18 === Chapter 3.4.2 --- Van der Waals Forces --- p.20 === Chapter 3.4.3 --- Capillary Force - (1st model) --- p.22 === Chapter 3.4.4 --- Capillary Force - (2nd model) --- p.23 === Chapter 3.4.5 --- Casimir Force --- p.26 === Chapter 3.4.6 --- Spring force of the beam --- p.27 === Chapter 3.4.7 --- Comparison of Forces --- p.28 === Chapter 3.4.8 --- Stress on Polysilicon --- p.30 === Chapter 4. --- Surface Force Measurement --- p.32 === Chapter 4.1 --- Experimental Setup --- p.33 === Chapter 4.2 --- Experimental Result --- p.34 === Chapter 4.2.1 --- Control Experiment of Rotation Sensor --- p.34 === Chapter 4.2.2 --- Freed-state and Snap-down-state --- p.35 === Chapter 4.2.3 --- Summary of the Experimental Data --- p.36 === Chapter 4.3 --- Comparison between Modelled Results and Experimental Data --- p.42 === Chapter 5. --- Assembly Experiment --- p.45 === Chapter 5.1 --- Experimental Setup --- p.45 === Chapter 5.2 --- Experimental Results --- p.46 === Chapter 5.3 --- Comparison among different chips --- p.52 === Chapter 6. --- Assembly Experiment (Double Chips) --- p.57 === Chapter 6.1 --- Experimental Setup --- p.57 === Chapter 6.2 --- Experimental Results --- p.58 === Chapter 6.2.1 --- Surface Profile measurement --- p.58 === Chapter 6.2.2 --- Summary of the surface profile measurement --- p.68 === Chapter 6.2.3 --- Assembly Results --- p.69 === Chapter 7. --- Assembly Experiment (Monitoring System in MUMPs46) --- p.72 === Chapter 7.1 --- Experimental Setup --- p.72 === Chapter 7.2 --- Experimental Results --- p.74 === Chapter 8. --- Other tested micro structures --- p.80 === Chapter 9. --- Conclusion --- p.82 === Chapter 10. --- Future Work --- p.83 === Chapter A. --- Appendix --- p.84 === Bibliography --- p.87