Amplitude thermal robustness study of GMR spin valve magnetic recording heads.

• Other Authors: Chan, Lai To.
• Format: Others
• Language: English; Chinese
• Published: 2000
• Subjects: Magnetic recorders and recording > Heads; Magnetoresistance; Electrodiffusion
• Online Access: http://library.cuhk.edu.hk/record=b5890369; http://repository.lib.cuhk.edu.hk/en/item/cuhk-323114

Chan Lai To = 硏究巨磁阻自旋閥磁記錄頭的靈敏度與溫度之關係 / 陳麗圖. === Thesis (M.Phil.)--Chinese University of Hong Kong, 2000. === Includes bibliographical references (leaves 80-83). === Text in English; abstracts in English and Chinese. === Chan Lai To = Yan jiu ju ci zu zi xuan fa ci ji lu tou de ling min du yu wen du zhi guan xi / Chen Litu. === Abstracts --- p.ii === 論文摘要 --- p.iii === Acknowledgements --- p.iv === Table of Contents --- p.v === List of Figures --- p.viii === Abbreviations --- p.xi === Chapter Chapter 1 --- Introduction --- p.1 === Chapter 1.1 --- History of Data Storage in Computers --- p.1 === Chapter 1.2 --- Structure and Working Principle of the Recording Head of a Magnetic Disk Storage device --- p.2 === Chapter 1.2.1 --- Structure of a Current Magnetic Recording Head --- p.2 === Chapter 1.2.2 --- Principle of Recording --- p.6 === Chapter 1.2.2.1 --- General Operating Principle of a Magnetic Recording Head --- p.7 === Chapter 1.2.2.2 --- Principle of Recording using AMR Elements --- p.9 === Chapter 1.2.2.3 --- Principle of Recording using GMR Elements --- p.14 === Chapter 1.3 --- Reliability of Magnetic Recording Heads --- p.23 === Chapter 1.3.1 --- Importance in the Determination of Reliability of Magnetic Recording Heads --- p.23 === Chapter 1.3.2 --- Current Relevant Reliability Issues in the Field --- p.23 === Chapter 1.4 --- Objectives of the Thesis Work --- p.24 === Chapter Chapter 2 --- Methodology --- p.25 === Chapter 2.1 --- Sample Preparation --- p.25 === Chapter 2.2 --- Principle of Amplitude Thermal Robustness Measurements --- p.28 === Chapter 2.2.1 --- Black's Equation --- p.28 === Chapter 2.2.2 --- Thermal Coefficient (TC) or Temperature Resistivity Coefficient Test --- p.29 === Chapter 2.2.3 --- Temperature Rise (TR) --- p.31 === Chapter 2.2.4 --- Thermal Electrical (TE) Stress Test (Accelerated Test) --- p.34 === Chapter 2.2.5 --- Maximum MR Resistance for Normal Device Operation --- p.38 === Chapter 2.3 --- Magnetic Field Effects Induced by the Biasing Current in an ATR Measurement --- p.40 === Chapter Chapter 3 --- Experimental Results and Data Analysis --- p.41 === Chapter 3.1 --- Results of the ATR Measurement --- p.43 === Chapter 3.1.1 --- Thermal Coefficient (TC) Test Result --- p.43 === Chapter 3.1.2 --- Temperature Rise (TR) Results --- p.48 === Chapter 3.1.3 --- Thermal Electrical (TE) Stress Test Result --- p.51 === Chapter 3.1.4 --- Maximum MR Resistance for Normal Device Operation --- p.60 === Chapter 3.2 --- Preliminary Data from the Magnetic Field Effects Induced by the Biasing Current in an ATR Measurement --- p.61 === Chapter Chapter 4 --- Discussion of Results and Failure Mechanisms --- p.62 === Chapter 4.1 --- Summary of the ATR characteristics of GMR heads --- p.62 === Chapter 4.2 --- "Comparison of ATR characteristics of AMR and GMR, and Discussion of Failure Mechanisms" --- p.63 === Chapter 4.2.1 --- ATR characteristics and Failure Mechanisms of AMR --- p.63 === Chapter 4.2.1.1 --- Summary of ATR characteristics of AMR heads --- p.63 === Chapter 4.2.1.2 --- Electromigration (EM) Induced Failure in AMR --- p.65 === Chapter 4.2.1.3 --- Diffusion Induced Failure in AMR --- p.67 === Chapter 4.2.2 --- Possibility of Diffusion Induced Failure in GMR --- p.68 === Chapter 4.2.3 --- Possibility of EM Induced Failure in GMR --- p.69 === Chapter 4.3 --- Magnetic-field Dependent ATR characteristics of GMR --- p.69 === Chapter 4.3.1 --- Temperature Dependence of the Exchange Coupling Field --- p.70 === Chapter 4.3.2 --- Rotation or Reversal of Magnetic Moments of the Pinned Layer --- p.75 === Chapter 4.3.3 --- Relaxation of the Magnetization of the Pinning Layer --- p.77 === Chapter Chapter 5 --- Conclusions and Suggestions for Future Work --- p.78 === References --- p.80