| Summary: | The following thesis is concerned with the development of fabrication techniques and novel designs for self-packaged, multilayer circuits using liquid crystal polymer (LCP) materials exclusively, given the favourable characteristics this material has for microwave circuits. Fabrication techniques are aimed at the production of miniature, low-profile filters. Advanced techniques for production of interlayer via connections are investigated and new methods proposed, with special attention at the lamination process and production of vertical, inter-layer transitions. Results obtained demonstrate the fabrication process is reliable for producing multilayer filters, with up to four metal layers, and via transitions in the region of 0.2 mm diameter. The fabrication process has been developed during this work is applied to novel filter designs, covering dual-band filters and lowpass filters. A new structure for dual- band filter is proposed, using folded multimode resonators (FMSIR). This structure is validated through the fabrication of two different filters with passbands 1.2/2.4 GHz, and 2.4/5 GHz, showing deep off-band rejection. Low pass structure covered in this thesis is based on the principle of destructive interference and aims at low insertion loss and out-of-band rejection higher than 40 dB. Fabricated samples validate the design showing a rejection in the region of 42 dB, with a cuto frequency of 3 GHz. Its small footprint and low insertion loss allows this type of lters to be used as cleanup filters. All the designs covered in this work are simulated using CAD tools and then validated by measurements on fabricated samples.
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