Characterization and reliability of Ag nanoparticle sintered joint for power electronics modules
Nowadays, numerous power electronics application requires operation at high temperatures. In order to address increasing change of reliability problems in power die attachments for high temperature and high reliability applications, sintering Ag nanoparticles has been used as bonding material for th...
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University of Nottingham
2016
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.703222 |