3D representation and characterisation of IC topography
As IC feature sizes reduce and the use of multi-layer metal becomes more widespread, ICs are becoming increasingly topographically complex, and the effects of interconnect on circuit performance ever more significant. The electrical properties of interconnect must be accurately determined, and this...
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University of Edinburgh
1998
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.649989 |