Thermosonic ball bonding : a study of bonding mechanism and interfacial evolution
Thermosonic ball bonding is a key technology in electrical interconnections between an integrated circuit and an external circuitry in microelectronics. Although this bonding process has been extensively utilised in electronics packaging industry, certain fundamental aspects behind all the practice...
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Loughborough University
2010
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.519963 |