Optoelectronic devices and packaging for information photonics
This thesis studies optoelectronic devices and the integration of these components onto optoelectronic multi chip modules (OE-MCMs) using a combination of packaging techniques. For this project, (1×12) array photodetectors were developed using PIN diodes with a GaAs/AlGaAs strained layer structure....
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Heriot-Watt University
2009
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.507893 |