Electro-thermal models for highly integrated SoC
In this thesis, electronic packaging technology was introduced and discussed from the device level to system level, followed by a review of crosstalk suppression, thermal management and electro-thermal modelling of electronic packages. The first dynamic electro-thermal UCSD HBT model for the OMMICTM...
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Queen's University Belfast
2008
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.486133 |