Enhanced copper electrodeposition onto printed circuit boards using pulsed current and eductor agitation
Printed Circuit Board (PCB) manufacture involves an electrolytic copper deposition stage for consolidation of conductive circuit paths. Miniaturisation trends requiring increased circuit densities and high aspect ratio through-holes are restricted by the phenomenon of non-uniform copper electrodepos...
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Loughborough University
1999
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.366592 |