Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing

Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing

abstract: This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked mi...

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Bibliographic Details
Other Authors: Ganesan, Kousik (Author)
Format: Doctoral Thesis
Language:English
Published: 2018
Subjects:
Materials Science
Chemical engineering
Chemistry
Copper Plating
Electrodeposition
Packaging
Plating
Reverse Pulse plating
Substrate Packaging
Online Access:http://hdl.handle.net/2286/R.I.49012

Internet

http://hdl.handle.net/2286/R.I.49012

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