Electrical and Thermal Transport in Alternative Device Technologies
abstract: The goal of this research work is to develop a particle-based device simulator for modeling strained silicon devices. Two separate modules had to be developed for that purpose: A generic bulk Monte Carlo simulation code which in the long-time limit solves the Boltzmann transport equation f...
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ndltd-asu.edu-item-209422018-06-22T03:04:38Z Electrical and Thermal Transport in Alternative Device Technologies abstract: The goal of this research work is to develop a particle-based device simulator for modeling strained silicon devices. Two separate modules had to be developed for that purpose: A generic bulk Monte Carlo simulation code which in the long-time limit solves the Boltzmann transport equation for electrons; and an extension to this code that solves for the bulk properties of strained silicon. One scattering table is needed for conventional silicon, whereas, because of the strain breaking the symmetry of the system, three scattering tables are needed for modeling strained silicon material. Simulation results for the average drift velocity and the average electron energy are in close agreement with published data. A Monte Carlo device simulation tool has also been employed to integrate the effects of self-heating into device simulation for Silicon on Insulator devices. The effects of different types of materials for buried oxide layers have been studied. Sapphire, Aluminum Nitride (AlN), Silicon dioxide (SiO2) and Diamond have been used as target materials of interest in the analysis and the effects of varying insulator layer thickness have also been investigated. It was observed that although AlN exhibits the best isothermal behavior, diamond is the best choice when thermal effects are accounted for. Dissertation/Thesis Qazi, Suleman Sami (Author) Vasileska, Dragica (Advisor) Goodnick, Stephen (Committee member) Tao, Meng (Committee member) Arizona State University (Publisher) Electrical engineering Bulk Silicon Device Scaling Monte Carlo Simulation Self Heating SOI Device Strained Silicon eng 56 pages M.S. Electrical Engineering 2013 Masters Thesis http://hdl.handle.net/2286/R.I.20942 http://rightsstatements.org/vocab/InC/1.0/ All Rights Reserved 2013 |
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Dissertation |
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Electrical engineering Bulk Silicon Device Scaling Monte Carlo Simulation Self Heating SOI Device Strained Silicon |
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Electrical engineering Bulk Silicon Device Scaling Monte Carlo Simulation Self Heating SOI Device Strained Silicon Electrical and Thermal Transport in Alternative Device Technologies |
description |
abstract: The goal of this research work is to develop a particle-based device simulator for modeling strained silicon devices. Two separate modules had to be developed for that purpose: A generic bulk Monte Carlo simulation code which in the long-time limit solves the Boltzmann transport equation for electrons; and an extension to this code that solves for the bulk properties of strained silicon. One scattering table is needed for conventional silicon, whereas, because of the strain breaking the symmetry of the system, three scattering tables are needed for modeling strained silicon material. Simulation results for the average drift velocity and the average electron energy are in close agreement with published data. A Monte Carlo device simulation tool has also been employed to integrate the effects of self-heating into device simulation for Silicon on Insulator devices. The effects of different types of materials for buried oxide layers have been studied. Sapphire, Aluminum Nitride (AlN), Silicon dioxide (SiO2) and Diamond have been used as target materials of interest in the analysis and the effects of varying insulator layer thickness have also been investigated. It was observed that although AlN exhibits the best isothermal behavior, diamond is the best choice when thermal effects are accounted for. === Dissertation/Thesis === M.S. Electrical Engineering 2013 |
author2 |
Qazi, Suleman Sami (Author) |
author_facet |
Qazi, Suleman Sami (Author) |
title |
Electrical and Thermal Transport in Alternative Device Technologies |
title_short |
Electrical and Thermal Transport in Alternative Device Technologies |
title_full |
Electrical and Thermal Transport in Alternative Device Technologies |
title_fullStr |
Electrical and Thermal Transport in Alternative Device Technologies |
title_full_unstemmed |
Electrical and Thermal Transport in Alternative Device Technologies |
title_sort |
electrical and thermal transport in alternative device technologies |
publishDate |
2013 |
url |
http://hdl.handle.net/2286/R.I.20942 |
_version_ |
1718700278088204288 |