Ab initio Study of Tantalum Nitride and Silver Adatoms
abstract: In 2022, integrated circuit interconnects will approach 10 nm and the diffusion barrier layers needed to ensure long lasting devices will be at 1 nm. This dimension means the interconnect will be dominated by the interface and it has been shown the interface is currently eroding device per...
| Other Authors: | |
|---|---|
| Format: | Doctoral Thesis |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/2286/R.I.14745 |