Electrostatic Coating with Charge-Compensated Ligandless Copper Nanoparticles
A nonaqueous electroless deposition (ELD) coating process that uses a charge compensator in lieu of a ligand or complexing agent is presented. Si(100) coupons were hydroxylated using a sulfuric acid-hydrogen peroxide mixture (SPM or piranha). The surface was terminated with an amine group by immersi...
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| Language: | en_US |
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The University of Arizona.
2016
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| Online Access: | http://hdl.handle.net/10150/612398 http://arizona.openrepository.com/arizona/handle/10150/612398 |