Development of Modeling, Simulation and Measurement Methodologies for Signal Integrity Analysis of High-Speed Packaging Interconnects
As chip complexity and speed continue to increase, the packaging interconnects increasingly affect the performance of the electrical systems. Signal integrity analysis becomes exceedingly complex and important. The primary goal of this research is in-depth understanding of the signal integrity issue...
| Main Author: | |
|---|---|
| Other Authors: | |
| Language: | EN |
| Published: |
The University of Arizona.
2006
|
| Online Access: | http://hdl.handle.net/10150/195316 |