Tribological, Kinetic and Thermal Characteristics of Copper Chemical Mechanical Planarization
Copper polishing performance depends significantly on the properties of pads, slurries, conditioning, pressure, sliding velocity, slurry flow rate and temperature. A slight variance in each of these parameters will cause significant change in polising results. Various investigations are performed du...
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| Language: | EN |
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The University of Arizona.
2005
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| Online Access: | http://hdl.handle.net/10150/193830 |