| Summary: | The cure kinetics of a high performance epoxy adhesive system based on
TGDDM/DGEBA/DDS/DICY and toughened with carboxy terminated
poly(acrylonitrile-co-butadiene) rubber with aluminum filler was investigated using
differential scanning calorimetry. Three different sets of experiments were performed to
follow the cure kinetics of the adhesive in a multi-step cure cycle. Three-dimensional
plots of data entered into a surface-fitting software allowed for the interpolation of the
degree and rate of cure as functions of heating rate and temperature, time and
temperature, or time and initial degree of cure. Isothermal cure was modeled successfully
using the kinetic model of Kamal. The gel point of the adhesive was measured using
dynamic shear rheometry under isothermal conditions. Methods were developed to
combine ramp and soak segments so that both the conversion (α) and rate of cure (dα/dt)
can be followed through a two-step cure cycle of the type used to cure composite prepreg
and adhesive in an industrial setting. === Thesis (M.S.)--Wichita State University, College of Liberal Arts and Sciences, Dept. of Chemistry. === "July 2006."
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