The design and development of a multilayer RF circuit card

<p>The goal of this project was to design an airborne radio frequency circuit card that was very light weight, occupied a small volume, and operated from 20 Mhz to 1500 Mhz. The circuit card being reported on is called an RF multicoupler, and is one of two cards used in a radio frequency d...

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Main Author: Ferro, John Francis
Other Authors: Systems Engineering
Format: Dissertation
Published: Virginia Tech 2014
Subjects:
Online Access:http://hdl.handle.net/10919/41140
http://scholar.lib.vt.edu/theses/available/etd-02162010-020032/
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spelling ndltd-VTETD-oai-vtechworks.lib.vt.edu-10919-411402020-09-11T05:29:39Z The design and development of a multilayer RF circuit card Ferro, John Francis Systems Engineering Pratt, Timothy J. Riad, Sedki Mohamed Davis, William A. Radio circuits LD5655.V851 1991.F477 <p>The goal of this project was to design an airborne radio frequency circuit card that was very light weight, occupied a small volume, and operated from 20 Mhz to 1500 Mhz. The circuit card being reported on is called an RF multicoupler, and is one of two cards used in a radio frequency distribution unit (RFD). This unit interfaces a large number of receivers to various antennas.</p> <p> In the past this type of circuitry was done by cascading discrete connectorized RF components together with coaxial cable. As technology progressed the discrete surface mount or pin through RF components were mounted on single layer fiberglass or Duroid circuit cards. The next generation improved circuit density by incorporating a multilayer RF circuit card in which RF and digital control signals were run on the internal layers.</p> <p> The RF multilayer circuit card in this project represents the state-of-the-art for high density RF circuitry. The board material is a teflon/fiberglass composite. The discrete RF components are surface mount and the passive higher frequency components are physically incorporated into the RF circuit card itself as stripline RF circuits.</p> <p> Thus, by using advanced board materials, a multilayer construction, integral stripline components, and a light weight aluminum housing, it was possible to achieve dramatic weight reductions.</p> <p>Finally, much effort was expended in "up front engineering" to ensure that this RFD was capable of being transitioned from a laboratory prototype to a production unit capable of being manufactured in large quantities.</p> Master of Engineering 2014-03-14T21:29:43Z 2014-03-14T21:29:43Z 1991-05-05 2010-02-16 2010-02-16 2010-02-16 Master's project etd-02162010-020032 http://hdl.handle.net/10919/41140 http://scholar.lib.vt.edu/theses/available/etd-02162010-020032/ LD5655.V851_1991.F477.pdf BTD application/pdf Virginia Tech
collection NDLTD
format Dissertation
sources NDLTD
topic Radio circuits
LD5655.V851 1991.F477
spellingShingle Radio circuits
LD5655.V851 1991.F477
Ferro, John Francis
The design and development of a multilayer RF circuit card
description <p>The goal of this project was to design an airborne radio frequency circuit card that was very light weight, occupied a small volume, and operated from 20 Mhz to 1500 Mhz. The circuit card being reported on is called an RF multicoupler, and is one of two cards used in a radio frequency distribution unit (RFD). This unit interfaces a large number of receivers to various antennas.</p> <p> In the past this type of circuitry was done by cascading discrete connectorized RF components together with coaxial cable. As technology progressed the discrete surface mount or pin through RF components were mounted on single layer fiberglass or Duroid circuit cards. The next generation improved circuit density by incorporating a multilayer RF circuit card in which RF and digital control signals were run on the internal layers.</p> <p> The RF multilayer circuit card in this project represents the state-of-the-art for high density RF circuitry. The board material is a teflon/fiberglass composite. The discrete RF components are surface mount and the passive higher frequency components are physically incorporated into the RF circuit card itself as stripline RF circuits.</p> <p> Thus, by using advanced board materials, a multilayer construction, integral stripline components, and a light weight aluminum housing, it was possible to achieve dramatic weight reductions.</p> <p>Finally, much effort was expended in "up front engineering" to ensure that this RFD was capable of being transitioned from a laboratory prototype to a production unit capable of being manufactured in large quantities.</p> === Master of Engineering
author2 Systems Engineering
author_facet Systems Engineering
Ferro, John Francis
author Ferro, John Francis
author_sort Ferro, John Francis
title The design and development of a multilayer RF circuit card
title_short The design and development of a multilayer RF circuit card
title_full The design and development of a multilayer RF circuit card
title_fullStr The design and development of a multilayer RF circuit card
title_full_unstemmed The design and development of a multilayer RF circuit card
title_sort design and development of a multilayer rf circuit card
publisher Virginia Tech
publishDate 2014
url http://hdl.handle.net/10919/41140
http://scholar.lib.vt.edu/theses/available/etd-02162010-020032/
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