UBM Formation on Single Die/Dice for Flip Chip Applications
This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between th...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/34792 http://scholar.lib.vt.edu/theses/available/etd-082699-110209/ |