Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
This research has developed a lead-free semiconductor device interconnect technology by studying the processing-microstructure-property relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, bi...
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| Format: | Others |
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/29409 http://scholar.lib.vt.edu/theses/available/etd-10312005-163634/ |