Packaging of a High Power Density Point of Load Converter

Packaging of a High Power Density Point of Load Converter

Due to the power requirements for today\'s microprocessors, point of load converter packaging is becoming an important issue. Traditional thermal management techniques involved in removing heat from a printed circuit board are being tested as today\'s technologies require small footprint...

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Bibliographic Details
Main Author:	Gilham, David Joel
Other Authors:	Electrical and Computer Engineering
Format:	Others
Published:	Virginia Tech 2013
Subjects:	Buck Converter High Power Density High Frequency Low Temperature Co-Fired Ceramics Ceramic Substrate Integration Electronic Packaging
Online Access:	http://hdl.handle.net/10919/19325

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