Interaction between plasma and low-k dielectric materials
With the scaling of devices, integration of porous ultra low-κ dielectric materials into Cu interconnect becomes necessary. Low-k dielectric materials usually consist of a certain number of methyl groups and pores incorporated into a SiO₂ backbone structure to reduce the dielectric constant. They ar...
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| Format: | Others |
| Language: | English |
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2008
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| Online Access: | http://hdl.handle.net/2152/3820 |