Fundamental studies of copper diffusion barriers

Fundamental studies of copper diffusion barriers

Not available === text

Bibliographic Details
Main Author: Engbrecht, Edward Raymond
Format: Others
Language:English
Published: 2008
Subjects:
Thin films
Copper wire
Microelectronics > Design and construction
Online Access:http://hdl.handle.net/2152/1958
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spelling ndltd-UTEXAS-oai-repositories.lib.utexas.edu-2152-19582015-09-20T16:50:20ZFundamental studies of copper diffusion barriersEngbrecht, Edward RaymondThin filmsCopper wireMicroelectronics--Design and constructionNot availabletext2008-08-28T22:25:25Z2008-08-28T22:25:25Z20042008-08-28T22:25:25ZThesiselectronicb60772736http://hdl.handle.net/2152/1958679880953143737engCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.
collection NDLTD
language English
format Others
sources NDLTD
topic Thin films
Copper wire
Microelectronics--Design and construction
spellingShingle Thin films
Copper wire
Microelectronics--Design and construction
Engbrecht, Edward Raymond
Fundamental studies of copper diffusion barriers
description Not available === text
author Engbrecht, Edward Raymond
author_facet Engbrecht, Edward Raymond
author_sort Engbrecht, Edward Raymond
title Fundamental studies of copper diffusion barriers
title_short Fundamental studies of copper diffusion barriers
title_full Fundamental studies of copper diffusion barriers
title_fullStr Fundamental studies of copper diffusion barriers
title_full_unstemmed Fundamental studies of copper diffusion barriers
title_sort fundamental studies of copper diffusion barriers
publishDate 2008
url http://hdl.handle.net/2152/1958
work_keys_str_mv AT engbrechtedwardraymond fundamentalstudiesofcopperdiffusionbarriers
_version_ 1716820064269762560

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