Experimental study of void formation in solder joints of flip-chip assemblies

Not available === text

Bibliographic Details
Main Author:	Wang, Daijiao, 1970-
Format:	Others
Language:	English
Published:	2008
Subjects:	Welded joints Solder and soldering Multichip modules (Microelectronics)
Online Access:	http://hdl.handle.net/2152/1754

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record_format	oai_dc
spelling	ndltd-UTEXAS-oai-repositories.lib.utexas.edu-2152-17542015-09-20T16:50:07ZExperimental study of void formation in solder joints of flip-chip assembliesWang, Daijiao, 1970-Welded jointsSolder and solderingMultichip modules (Microelectronics)Not availabletext2008-08-28T22:15:50Z2008-08-28T22:15:50Z20052008-08-28T22:15:50ZThesiselectronicb60093869http://hdl.handle.net/2152/1754621105473184813engCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.
collection	NDLTD
language	English
format	Others
sources	NDLTD
topic	Welded joints Solder and soldering Multichip modules (Microelectronics)
spellingShingle	Welded joints Solder and soldering Multichip modules (Microelectronics) Wang, Daijiao, 1970- Experimental study of void formation in solder joints of flip-chip assemblies
description	Not available === text
author	Wang, Daijiao, 1970-
author_facet	Wang, Daijiao, 1970-
author_sort	Wang, Daijiao, 1970-
title	Experimental study of void formation in solder joints of flip-chip assemblies
title_short	Experimental study of void formation in solder joints of flip-chip assemblies
title_full	Experimental study of void formation in solder joints of flip-chip assemblies
title_fullStr	Experimental study of void formation in solder joints of flip-chip assemblies
title_full_unstemmed	Experimental study of void formation in solder joints of flip-chip assemblies
title_sort	experimental study of void formation in solder joints of flip-chip assemblies
publishDate	2008
url	http://hdl.handle.net/2152/1754
work_keys_str_mv	AT wangdaijiao1970 experimentalstudyofvoidformationinsolderjointsofflipchipassemblies
_version_	1716820003553017856

Experimental study of void formation in solder joints of flip-chip assemblies

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