Copper and Silver Metallization for High Temperature Applications
High-temperature electrical- and morphological-stability of interconnect is critical for electronic systems based on wide band gap (WBG) semiconductors. In this context, the thermal stability of both Ag and Cu films with Ta and TaN films as diffusion barriers and/or surface-capping layers at high te...
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| Format: | Doctoral Thesis |
| Language: | English |
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Uppsala universitet, Fasta tillståndets elektronik
2016
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-300796 http://nbn-resolving.de/urn:isbn:978-91-554-9656-2 |