Flip-chip bonding by electroplated indium bump
In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. Flip-chip bonding is a vertical connection...
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| Format: | Others |
| Language: | English |
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Mittuniversitetet, Avdelningen för elektronikkonstruktion
2015
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27178 |