Automating IEEE 1500 wrapper insertion
Integrated circuits (ICs) are becoming increasingly complex, which leadsto long design and development times. Designing ICs in a modular fashionis efficient to shorten design and development times. Due to imperfection inIC manufacturing, all ICs are tested. An IC designed in a modular fashioncan be...
Main Author: | Huss, Niklas |
---|---|
Format: | Others |
Language: | English |
Published: |
Linköpings universitet, Institutionen för datavetenskap
2009
|
Subjects: | |
Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-52347 |
Similar Items
-
Using IEEE 1500 for wafer testing of TSV Based 3D integrated circuits
by: Ugland, Ryan A.
Published: (2012) -
Asynchronous Wrapper for Globally Asynchronous Locally Synchronous Systems
by: Manbo, Olof
Published: (2002) -
Adaptation of Software Testability Concept for Test Suite Generation : A systematic review
by: Malla, Prakash, et al.
Published: (2012) -
Monitoring Components by Using Aspects and Contracts in Wrappers
by: Yang, Xiaofeng
Published: (2011) -
SWIGLAL: Python and Octave interfaces to the LALSuite gravitational-wave data analysis libraries
by: Karl Wette
Published: (2020-07-01)