Termination and passivation of Silicon Carbide Devices.

Silicon carbide rectifiers are commercially available since 2001, and MESFET switches are expected to enter the market within a year. Moreover, three inch SiC wafers can be purchased nowadays without critical defects for the device performance and four inch substrate wafers are announced for the yea...

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Main Author: Wolborski, Maciej
Format: Others
Language:English
Published: KTH, Mikroelektronik och Informationsteknik, IMIT 2005
Subjects:
SiC
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-439
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spelling ndltd-UPSALLA1-oai-DiVA.org-kth-4392013-01-08T13:10:44ZTermination and passivation of Silicon Carbide Devices.engWolborski, MaciejKTH, Mikroelektronik och Informationsteknik, IMITStockholm : KTH2005Silicon CarbideSiCpassivationdielectric materialsSemiconductor physicsHalvledarfysikSilicon carbide rectifiers are commercially available since 2001, and MESFET switches are expected to enter the market within a year. Moreover, three inch SiC wafers can be purchased nowadays without critical defects for the device performance and four inch substrate wafers are announced for the year 2005. Despite this tremendous development in SiC technology, the reliability issues like device degradation or high channel mobility still remain to be solved. This thesis focuses on SiC surface passivation and termination, a topic which is very important for the utilisation of the full potential of this semiconductor. Three dielectrics with high dielectric constants, Al2O3, AlN and TiO2, were deposited on SiC with different techniques. The structural and electrical properties of the dielectrics were measured and the best insulating layers were then deposited on fully processed and well characterised 1.2 kV 4H SiC PiN diodes. For the best Al2O3 layers, the leakage current was reduced to half its value and the breakdown voltage was extended by 0.5 kV, reaching 1.6 kV, compared to non passivated devices. As important as the proper choice of dielectric material is a proper surface preparation prior to deposition of the insulator. In the thesis two surface treatments were tested, a standard HF termination used in silicon technology and an exposure to UV light from a mercury lamp. The second technique is highly interesting since a substantial improvement was observed when UV light was used prior to the dielectric deposition. Moreover, UV light stabilized the surface and reduced the leakage current by a factor of 100 for SiC devices after 10 Mrad γ ray exposition. The experiments indicate also that the measured leakage currents of the order of pA are dominated by surface leakage. QC 20110114Licentiate thesis, comprehensive summaryinfo:eu-repo/semantics/masterThesistexthttp://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-439Trita-FTE, 0284-0545 ; 2005:3application/pdfinfo:eu-repo/semantics/openAccess
collection NDLTD
language English
format Others
sources NDLTD
topic Silicon Carbide
SiC
passivation
dielectric materials
Semiconductor physics
Halvledarfysik
spellingShingle Silicon Carbide
SiC
passivation
dielectric materials
Semiconductor physics
Halvledarfysik
Wolborski, Maciej
Termination and passivation of Silicon Carbide Devices.
description Silicon carbide rectifiers are commercially available since 2001, and MESFET switches are expected to enter the market within a year. Moreover, three inch SiC wafers can be purchased nowadays without critical defects for the device performance and four inch substrate wafers are announced for the year 2005. Despite this tremendous development in SiC technology, the reliability issues like device degradation or high channel mobility still remain to be solved. This thesis focuses on SiC surface passivation and termination, a topic which is very important for the utilisation of the full potential of this semiconductor. Three dielectrics with high dielectric constants, Al2O3, AlN and TiO2, were deposited on SiC with different techniques. The structural and electrical properties of the dielectrics were measured and the best insulating layers were then deposited on fully processed and well characterised 1.2 kV 4H SiC PiN diodes. For the best Al2O3 layers, the leakage current was reduced to half its value and the breakdown voltage was extended by 0.5 kV, reaching 1.6 kV, compared to non passivated devices. As important as the proper choice of dielectric material is a proper surface preparation prior to deposition of the insulator. In the thesis two surface treatments were tested, a standard HF termination used in silicon technology and an exposure to UV light from a mercury lamp. The second technique is highly interesting since a substantial improvement was observed when UV light was used prior to the dielectric deposition. Moreover, UV light stabilized the surface and reduced the leakage current by a factor of 100 for SiC devices after 10 Mrad γ ray exposition. The experiments indicate also that the measured leakage currents of the order of pA are dominated by surface leakage. === QC 20110114
author Wolborski, Maciej
author_facet Wolborski, Maciej
author_sort Wolborski, Maciej
title Termination and passivation of Silicon Carbide Devices.
title_short Termination and passivation of Silicon Carbide Devices.
title_full Termination and passivation of Silicon Carbide Devices.
title_fullStr Termination and passivation of Silicon Carbide Devices.
title_full_unstemmed Termination and passivation of Silicon Carbide Devices.
title_sort termination and passivation of silicon carbide devices.
publisher KTH, Mikroelektronik och Informationsteknik, IMIT
publishDate 2005
url http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-439
work_keys_str_mv AT wolborskimaciej terminationandpassivationofsiliconcarbidedevices
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