Structural optimization of electronic packages using DOE
The reliability of a mechanical system containing electronic packages is highly affectedby the environment the system is stationed in. The difference and fluctuationsbetween the ambient temperature and the operating temperature of the electronicpackage cause accumulation of inelastic strains in the...
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| Format: | Others |
| Language: | English |
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KTH, Hållfasthetslära
2020
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-285859 |