Development of Through Glass Vias (TGVs) for Interposer Applications

• Main Author: Cornean, Vlad
• Format: Others
• Language: English
• Published: KTH, Mikro- och nanosystemteknik 2014
• Online Access: http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-165618

In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). TGVs were fabricated by introducing nickel wires in via-holes that were pre-made on a glass substrate and applying a spin-on polymer to isolate the nickel wires from the walls of the via-holes. Another focus of this work was improving the TGV and TSV manufacturing process. This was done by investigating the inuence of the assembly speeds on the yield of the assembly process. Two methods for removing the excess wires left on the surface of the wafer after the magnetic assembly of the nickel wires were tested. Also the inuence the pitch between the via-holes has on the yield of the process was investigated.