Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performa...

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Bibliographic Details
Main Author: Antelius, Mikael
Format: Doctoral Thesis
Language:English
Published: KTH, Mikro- och nanosystemteknik 2013
Subjects:
Microelectromechanical systems
MEMS
Nanoelectromechanical systems
NEMS
silicon
wafer-level
packaging
vacuum packaging
liquid encapsulation
integration
wire bonding
grating coupler
waveguide
Fabry-Perot resonator
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-119839
http://nbn-resolving.de/urn:isbn:978-91-7501-676-4

Internet

http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-119839
http://nbn-resolving.de/urn:isbn:978-91-7501-676-4

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