Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

Bibliographic Details
Main Author:	Mohammadi Panah, Mahshid
Format:	Others
Language:	English
Published:	Blekinge Tekniska Högskola, Institutionen för maskinteknik 2014
Subjects:	Area array flip chip Gold bump joint Thermal mismatch Thermo mechanical failure
Online Access:	http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918

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